Smd ic packages


  • The most popular form of IC package is ______
  • Types of ic packages
  • What are the different types of IC packages?
  • Different Types Of IC Packaging, How To Choose One?(Tutorial In 2021)
  • IC packaging: How Should we Choose Different Types of IC Packaging?
  • The most popular form of IC package is ______

    The performance of the package also acts as a limiting factor. Hence, engineers use them mostly for wire-bondable finishes and wire-bond interconnected die. And a perfect example is gold or silver. These finishes get plated in the inner bond-land area via a spot-plating method. But, the low CTE could have a harmful effect. However, the size of the CTE plays a significant role.

    And we can link everything to the mismatch of most common PCB substrates. We must also note that lower CTE metals have an excellent reputation to work well as lead frames.

    And they work perfectly for plastic DIP-type and ceramic packages. However, copper lead frame materials are usually an ideal choice for surface mount plastic packages. Copper also has a higher conductivity, which is a great plus. Since the late s, laminates have been in existence. And then, they used them for chip-on-board systems. It comes with all the necessary elements required in a package.

    Plus, it has a package situated in the original place. Asides from that, laminate packages serve as cost-effective options. Thus, most engineers widely use it because of its economic value. Also, engineers prefer newer organic laminates with higher temperatures.

    But they have more preferred electrical attributes. A great example is the lower dielectric constant. Die-Attach Materials Die-attach materials are excellent for bonding die to the substrate.

    The process may seem easy at first, but it has various requirements. And it depends on the application. However, most times, the die attach is ideal for face-up-wire-bond assembling.

    Also, the die-attach process must have no vacuums in the attached material. That way, you can avoid hot spots on the die. And as the chip-power of the die-attach material rises, it gets more value. Encapsulants An encapsulant is more like the final piece of an IC package. Hence, it has a primary function of protection.

    And the encapsulants protect the delicate bond wires and chip from the environment and physical damage. So, you need to apply it with precision and care. When it comes to IC packaging, there are three basic types of encapsulant materials that are useful: 5.

    After all, organic resins are the most common in structural-engineering applications. And they come in handy for IC chips. No doubt, the processing and curing regimens of silicon materials are similar to organic resins. But, this material is not an organic resin. There are two basic types of silicone resins: Room temperature-vulcanizable RTV Solvent-based You can also achieve curing converting silicone to solid with different mechanisms.

    And it depends on the type of silicone material you choose. As for the room-temperature-vulcanizable, you can cure it either by: Catalyst addition Exposure to moisture room humidity On the other hand, the most common way you can cure solvent-based resins is by thermal means.

    But, you can only fix the solvent-based resins after evaporation of the solvent. Silicone resins are a popular choice for CSPs seeking compliance. And it makes a wonderful choice thanks to its beneficial features like: Remarkable resistance to chemicals.

    Types of ic packages

    Tutorial In Almost every electronic circuit is composed of IC integrated circuit and ICs have become an essential element in advanced electronics. The design and development of ICs have rigorously evolved over the years; ICs have become compact, less power consuming, and more functional.

    But this change came with evolution in IC packaging; the IC packaging has evolved with time. Today, designers can choose between packaging types as per project feasibility. But how do IC packaging types impact the efficiency of electronic circuit boards? The answer remains with the characteristics of IC packaging. Each package has different characteristics that in one way or the other make the circuit more effective.

    What is IC Packaging? Integrated circuits are developed with semi-conductors which are small and delicate. Given the small size of semi-conductors, a physical connection between the semiconductor chips and the circuit is challenging and impractical. Moreover, the chips have to be protected against corrosion and any unwanted electrical contact. To protect chips and develop IC pins so that the semiconductor can be connected with the circuit, they are housed inside a package.

    The package can be smaller than your nails or it can be larger; depending on the package type. The evolution in IC packaging started in the s and since then, the IC packages have evolved to an extent that today, a Micro SD memory card holds much more data than a huge hard disk drive did in the 20th century.

    Through-hole Devices Traditionally, through-hole devices are commonly used. They have legs extended enough to go through holes in PCB printed circuit board. The devices are placed on one side of the PCB and soldered on the other side.

    Since through-hole components are simple, they are less costly as compared to surface mount devices. This is why most of the low-cost electronics use through-hole components.

    However, through-hole components are several times larger than surface-mount devices which means they require more space on board. Some of the common types of through-hole packages are as follows. The number of pins is usually in a multiple of four, the housing is typically rectangular.

    However, the shape can be different for some devices; depending on the internal architecture. The pins extended from the insides to a right angle towards the bottom. The distance between all adjacent pins is 0. Standard Through-hole Package Standard through-hole package is the most commonly used type of through-hole package in industrial manufacturing.

    The standard through-hole package maintains a 0. Shrink Package Shrink package components are also the same as standard through-hole components except, shrink components are smaller and they have a 0. Shrink packaging is usually used for components that have several pins and have to be developed in a smaller size. ZIP components did not gain popularity due to their bent architecture which caused complications during assembling process.

    But today, ZIP components are rarely or no longer developed due to no demand. SMDs are compact and expensive as compared to through-hole packaging. But their compact size also enables the development of huge circuits on small printed circuit boards.

    Moreover, they do not require hole-drilling for pin soldering; all pins and the packaging lie on the same side of the board. The components are picked, placed, and assembled on the PCB using special equipment.

    The fabrication process is less time-consuming but given the small size of SMDs, fabrication can be challenging. When multiple SMDs are placed closer, problems can arise and their detection is also difficult. Both types are commonly used on an industrial scale. They extend out of the component housing, go vertically downward, and then take a right angle; getting parallel to the board which makes an L-shape.

    This L-shape keeps the leads in a horizontal direction to the boards which eases the assembling process. L-shaped Lead Packages are commonly used in random access memory and power flash memory development.

    The bottom is composed of small leads that form contact with the circuit. BGA packaging is commonly used in high-speed applications especially computers. They can be seen on motherboards in computers. The material of IC packaging determines its characteristics which impact the circuit efficiency.

    Some of the commonly used IC packaging materials are as follows. For example, glass and ceramics are used as insulators. Similarly, metals and polymers are used as conductors.

    Whereas the composites are used for thermal enhancement and conduction. Patch Material The Patch materials are fabrics, used for covering an unwanted opening in the IC packaging. Typically, the piezoelectric material is used in IC packaging as patch material.

    However, there are several other patch materials used in IC packaging. The agenda of using a sealant in IC packaging is no different; it is to protect the semiconductor chip against moisture and water.

    Since the semiconductor chip is delicate and can easily rust, the sealant helps protect it against rust. Moreover, the sealant keeps the packaging insides air-tight. Typically silicone sealants are used in IC packaging as they are highly durable and reliable. However, other types of sealants are also used in IC packaging. Through-hole Devices VS Surface Mount Devices, Major Differences As stated above, there are a number of differences in physical appearance and the way both packages form contact with the circuit.

    But apart from these differences, certain other factors must be considered when choosing one. The in-depth details of these factors are explained as follows. Their miniature size extensively reduces the space required for assembling which reduces the overall board size. For projects that have size limitations, surface mount device packaging is more feasible. Component Density Surface mount packaging is much smaller than the through-hole packaging which is why the surface mount packaging can fit it in several components and yet remain smaller than the through-hole package.

    Apparently, surface mount packaging enables functionality achievement with lesser space consumption. Error Detection Despite extensive care and measurements, electronic circuit development is prone to errors. Whether it be a surface mount packaging-based circuit or a through-hole packaging-based circuit, fault can occur in both. But the difference comes in error detection and correction. The miniature size of surface-mount packaging causes difficulty in error detection as all the components are extremely small and the pins are too close.

    Whereas in through-hole packaging, the overall size of the packaging is comparatively larger and the distance between pins is greater. This larger distance between the pins enables easy error detection as each pin can be approached easily. It is essential to consider the electromagnetic compatibility of an IC packaging to ensure it is feasible for the desired circuit.

    Surface mount packaging has better electromagnetic compatibility as compared to through-hole packaging. It means that the surface mount components are less prone to electromagnetic signals hence they are more efficient. This is because the surface mount devices have a shorter return path. Product Cost As already explained through-hole packaging is comparatively less-costly which helps reduce the overall product cost. Apart from that, there are other cost-savings associated with the use of through-hole packaging.

    For example, the assembling of through-hole components does not require any expensive equipment like a pick-and-place machine. As explained above, there are several differences between through-hole and surface mount packaging and the designer has to consider multiple parameters. Apparently, choosing the right type of IC packaging can help save cost but a wrongly chosen type can cause certain compatibility issues and elevate product cost.

    The packaging keeps the IC safe and secure, protects it against mechanical stress and corrosion. This is why designers must choose a suitable type of IC packaging before buying components. Following are detailed factors that designers must consider while choosing IC packaging. The number of pins inputs and outputs must be considered.

    Typically, BGAs have a high number of pins whereas QFN quad-flat no-leads packaging components have a fewer number of pins. In case of limitations, the QFN package is more suitable but if you prefer a high pin count then the BGA package is more feasible.

    The thermal specificationsof an IC vary from package to package. It is not essential if the circuit has to operate at a nominal temperature and is not prone to excessive heating or cooling. Moreover, smaller components are likely to damage while soldering as their temperature elevates. So, the IC packaging must be chosen as per the thermal specifications. It is recommended to use BGA packaging for high heat-dissipation.

    Another important factor is the operational speedof the circuit. Again, for high-speed circuits, it is recommended to use BGA packaging. Lastly, consider the time needed to assemble the circuit.

    In some projects, the deadlines are short or several circuits have to be developed in a short time. Given the short time through-hole packaging takes to assemble, through-hole components are more suitable. Without proper IC packaging, the IC is prone to environmental effects, electromagnetic signals, and mechanical stress. Moreover, IC packaging has an important role in the assembling process. Some IC packagings are more convenient to assemble while some are comparatively complicated.

    But all packaging types have pros and cons.

    What are the different types of IC packages?

    Zigzag Inline Packages These packages have a single row of pins and have a through-hole mounting style. The leads are vertically arranged along the boundary line of the package, just like SIP but are arranged by mutual folding in zigzag. This package type was introduced to increase the package density of DRAM. At present, it is only used by some analog ICs. Dual In-line Packages These packages have two rows of pins and have a through-hole mounting style.

    The leads are arranged in two parallel rows along the package length hanging vertically downwards. This is one of the most popular package styles.

    Though for commercial use, those ICs may be available in surface-mount packages. Dual in-line packages are handy to use on breadboards and prototyping boards. Quadruple Inline Package This package type is similar to DIP except that the leads on two rows are alternatively vertical and zigzag.

    The leads are arranged horizontally in two or four rows with surface-mount style.

    Different Types Of IC Packaging, How To Choose One?(Tutorial In 2021)

    Due to smaller pitches, these packages require expensive board processing and finer IC handling. These packages are rarely used in commercial applications due to high PCB costs.

    Surface Mount Small Outline Packages These package types have two rows of terminals and a surface-mount mounting style. The ratio between the chip area and the package area is small. BGA type package With the development of integrated circuit technology, the packaging requirements for integrated circuits are more stringent. This is because the packaging technology is related to the functionality of the product.

    The BGA package has the following features: 1. BGA array solder ball has short pins, which shortens the signal transmission path, reduces lead inductance and resistance, and has small signal transmission delay and greatly improved adaptation frequency, thus improving circuit performance.

    Assembly can be used for coplanar welding, and the reliability is greatly improved. A typical feature of this type of package is that many pins are placed around the packaged chip.

    The package operation is convenient and the reliability is relatively high. It is one of the current mainstream packaging methods. Currently, it is commonly applied to some memory type ICs. QFN package type The QFN is a leadless quad flat package that is a lead-free package with a peripheral termination pad and a die pad for mechanical and thermal integrity exposure.

    The package can be square or rectangular. The four sides of the package are equipped with electrode contacts. From the market point of view, QFN packaging is more and more concerned by users.

    IC packaging: How Should we Choose Different Types of IC Packaging?

    Considering the cost and volume factors, QFN packaging will be a growth point in the next few years, and the development prospects are extremely optimistic. PLCC is a special pin chip package, which is a kind of chip package.

    The pins of this package are bent inward at the bottom of the chip, so the chip pins are not visible in the top view of the chip.

    This chip is soldered using a reflow process and requires special soldering equipment.


    Smd ic packages